HY P15 Thermal Grease CPU Chipset Cooling Compound Silicone Plaster Heat Sink Compound 15.2-W/m-k 1G/2G thermal grease compound remover thermal grease electronics

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  THERMAL CONDUCTIVITY - 15.2W/m-K

  
  
  



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  SPECIFICATION GRAVITY - 2.5g/ML

  
  
  



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  TEMPERATURE RANGE - -20-130 Degree c

  
  
  



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  VISCOSITY - 130Pa S

  
  
  

Features:

brand new and

Apply to CPU, VGA, Chipset, Radiator and other PC components.

Thermal grease helps your electrical appliance to thermal conductivity and heat dissipation.

Helps disperse the heat from CPU to heatsink effectively.

To ensure that the electronic instruments meters- and other electrical performans stability.

High temperature resistant tasteless, non-corrosive.Low thermal resistant and high conductivity for superior heat transfer.

Specifications:

Model: HY P15

Color: Gray

Capacity: 1G

Thermal conductivity:approx 15.2-W/m-k

Concentration: 280±10 1/10mm

Instantaneous temperature resistance: -30-180℃

Working temperature: -20-150℃